Short Link Efficient Interconnect Circuitry

ABSTRACT

Systems and methods for electronic devices including two or more semiconductor devices coupled via an interconnect. The interconnect includes multiple lanes each having a link between the first and second semiconductor devices. One or more lanes of the multiple lanes each include clock and data recovery circuitry to perform full clock and data recovery. One or more other lanes of the multiple lanes each do not include clock and data recovery circuitry and instead includes a phase adjustment and clock multiplier circuit that is slave to clock and data recovery circuitry of the one or more lanes.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/736,436, filed on Jan. 7, 2020, which is a continuation of U.S.patent application Ser. No. 16/230,974, filed on Dec. 21, 2018, whichare incorporated by reference herein in their entireties and for allpurposes.

BACKGROUND

This disclosure relates to links through an interconnect for asemiconductor device.

This section is intended to introduce the reader to various aspects ofart that may be related to various aspects of the present disclosure,which are described and/or claimed below. This discussion is believed tobe helpful in providing the reader with background information tofacilitate a better understanding of the various aspects of the presentdisclosure. Accordingly, it may be understood that these statements areto be read in this light, and not as admissions of prior art.

Two or more semiconductor components may be included together in asingle package. An interconnect (e.g., via an interposer or aninterconnect bridge embedded in a substrate) may provide connections inthe package. As components of the package become more integratedtogether, higher throughput is used, which, in turn, results in a higherdensity of active-circuit blocks and a smaller area for heatdissipation. Furthermore, interconnect overhead may exacerbate thisissue. That package may include one or more clock domains that theinterconnect navigates. For instance, in transferring data across theinterconnect, for each lane of the interconnect, the package may includeclock and data recovery circuitry that is relatively large and powerhungry relative to other circuits for each lane.

BRIEF DESCRIPTION OF THE DRAWINGS

Various aspects of this disclosure may be better understood upon readingthe following detailed description and upon reference to the drawings inwhich:

FIG. 1 is a diagram of a semiconductor device that utilizes short linkefficient interconnect circuitry, in accordance with an embodiment;

FIG. 2 is a schematic diagram of the short link efficient interconnectcircuitry of FIG. 1, in accordance with an embodiment;

FIG. 3 is a schematic diagram of the short link efficient interconnectcircuitry of FIG. 1, in accordance with an embodiment;

FIG. 4 is a block diagram of a memory block of the semiconductor device,in accordance with an embodiment; and

FIG. 5 is a block diagram of a data processing system that may use thesemiconductor device to respond rapidly to data processing requests, inaccordance with an embodiment.

DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS

One or more specific embodiments will be described below. In an effortto provide a concise description of these embodiments, not all featuresof an actual implementation are described in the specification. It maybe appreciated that in the development of any such actualimplementation, as in any engineering or design project, numerousimplementation-specific decisions must be made to achieve thedevelopers' specific goals, such as compliance with system-related andbusiness-related constraints, which may vary from one implementation toanother. Moreover, it may be appreciated that such a development effortmight be complex and time consuming, but would nevertheless be a routineundertaking of design, fabrication, and manufacture for those ofordinary skill having the benefit of this disclosure.

When introducing elements of various embodiments of the presentdisclosure, the articles “a,” “an,” and “the” are intended to mean thatthere are one or more of the elements. The terms “comprising,”“including,” and “having” are intended to be inclusive and mean thatthere may be additional elements other than the listed elements.Additionally, it should be understood that references to “oneembodiment” or “an embodiment” of the present disclosure are notintended to be interpreted as excluding the existence of additionalembodiments that also incorporate the recited features. Furthermore, thephrase A “based on” B is intended to mean that A is at least partiallybased on B. Moreover, unless expressly stated otherwise, the term “or”is intended to be inclusive (e.g., logical OR) and not exclusive (e.g.,logical XOR). In other words, the phrase A “or” B is intended to mean A,B, or both A and B.

As previously discussed, interconnects provide connections in electronicdevices. As components of the electronic devices become more integratedtogether, higher throughput is used, which, in turn, results in a higherdensity of active-circuit blocks and a smaller area for heatdissipation. By reducing channel loss of transceiver devices, powerconsumption (and heat production) may generally be reduced in thetransceiver devices. The interconnect scheme discussed herein includesreduced channel loss and reduced power consumption. Specifically, theinterconnect takes advantage of the short nature of die-to-die (D2D)connections, die-to-optical-electrical-module (D2OE) connections,die-to-memory (D2M) connections, and/or similar connections in anelectronic device package. For instance, the D2D, D2OE, D2M, and/orsimilar connections may use extra short reach (XSR) links having anoverall length less than 50 mm or may use ultra short reach (USR) linkshaving an overall length less than 10 mm. As discussed below, due tothese short distances and low corresponding voltages may result inreduced equalization utilization compared to longer links and/or mayresult in smaller signal swings and overall amplitude. Due to thereduced equalization utilization, full clock and data recovery (CDR)with CDR circuitry in each lane may be foregone by omitting the CDRcircuitry from at least some lanes of the interconnect. Instead, thoselanes may use phase adjustment and clock multiplier (PA/M) circuitriesto replace the CDR circuitry and may act as a slave of a CDR in anotherlane of the interconnect.

FIG. 1 is a diagram of an electronic device 10. The die may include asystem-on-chip (SOC) and/or any other electronic device with multiplecomponents. The electronic device 10 includes an interconnect 12. Theinterconnect 12 for the electronic (e.g., semiconductor) device 10provides links between a component 14 and a component 16 of theelectronic device 10. The components 14 and/or 16 may include one ormore die or other components. For instance, the die of the component 14may include a programmable fabric (e.g., as part of a field-programmablegate array (FPGA) device), a CPU, an application-specific integratedcircuit, memory, and/or other suitable die for use in an electronicdevice. Furthermore, the SOC may be a photonic-integrated SOC thatincorporates optical circuitry to perform photonic functions. Forinstance, the photonic-integrated SOC may provide the interconnect 12between the component 14 as a die and the component 16 as an opticalengine that provides connectivity of the die to optical fiber 18 forfiber optics. Although the illustrated embodiment depicts the electronicdevice 10 as a photonic-integrated SOC, the electronic device 10 mayadditionally or alternatively include atransceiver/serializer/deserializer (SerDes)-integrated SOC.Furthermore, additionally or alternative, the electronic device 10 mayinclude multiple integrated S OCs.

The electronic device 10 may also include a substrate 19 to which thecomponents 14 and 16 may be coupled. Additionally or alternatively, theelectronic device 10 may utilize an embedded interconnect bridge (EMIB)to couple the components 14 and 16 together. For instance, the substrate19 may be an interposer to which the components 14 and 16 are mounted.The substrate 19 may use microbumps 20 to couple to a circuit board 22.The electronic device 10 may communicate with other electroniccomponents via the optical fiber 18 and/or the circuit board 22.

FIG. 2 is a schematic diagram of a connection 30 having multiple lanes32 between a host complex 34 (e.g., component 14) and an optical engine36 (e.g., component 16). Each lane 32 includes a host-to-optical (e.g.,outgoing) channel and an optical-to-host (e.g., incoming) channel. Forinstance, the lane 32A includes a host-to-optical channel 38 and anoptical-to-host channel 40, the lane 32B includes a host-to-opticalchannel 42 and an optical-to-host channel 44, and the lane 32C includesa host-to-optical channel 46 and an optical-to-host channel 48. Each ofthe host-to-optical channels 38, 42, and 46 and the optical-to-hostchannels 40, 44, and 48 each includes a link 50 (e.g., through theinterconnect 12) between the host complex 34 and the optical engine 36.

Each host-to-optical channel 38, 42, and 46 includes a transmitter 52that transmits signals over a corresponding link 50 to a receiver 54 inthe optical engine 36. The receiver 54 receives the signals andtransmits them to a laser driver 56 that causes a modulator 59 tomodulate a laser 58 to cause transmission of optical signals over anoptical fiber 60 as an optical output 62 from the electronic device 10.

Similar to the host-to-optical channels 38, 42, and 46, theoptical-to-host channels 40, 44, and 48 each receives optical signalsvia an optical input 64 and over an optical fiber 66. The opticalsignals are received from the optical fiber 66 at a photo detector 68that converts the optical signals into electrical signals. Theelectrical signals are then passed to a transimpedance amplifier 70. Thetransimpedance amplifier 70 may be used to ameliorate attenuation oflight in the optical fiber 66 and/or to amplify the electrical signalsthat are passed to an equalizer 72. The equalizer 72 passes electricalsignals to an elastic buffer 74 that is used to ensure data integritywhen bridging a clock domain 75 of the optical engine 36 to a clockdomain 76 of the host complex 34. For instance, the elastic buffer 74may be a FIFO where data is deposited using a rate set by a clock of theclock domain 75 and removed using a rate set by a clock of the clockdomain 76. In other words, by including the elastic buffer 74 in theoptical engine 36, clock domain conversions for the optical-to-hostchannels 40, 44, and 48 are performed in the optical engine 36 beforetransfer over the corresponding data links 50 using transmitters 77. Thedata transmitted by the transmitters 77 is received by receivers 78 ofthe host complex 34.

The clock domains 75 and 77 both utilize a clocking system 80 thatoutputs a common clock 81 to both the host complex 34 and the opticalengine 36 from a common clock source 82 via clock management units 84.The common clock 81 is passed into the optical engine 36 and forwardedas a forward clock 86 to the host complex 34 along the link 50.Similarly, the common clock 81 is passed into the host complex 34 andforwarded as a forward clock 88 to the optical engine 36 along the link50. The common clock 81 may be used to drive various circuitry in thehost complex 34, but the forward clock 86 is used to control phaseadjustment and clock multipliers (PA/Ms) 90 in the host complex 34.Similarly, the common clock 81 may be used to drive various circuitry inthe optical engine 36, but the forward clock 88 is used to control PA/Ms92 in the optical engine 36.

Each optical-to-host channel 40, 44, and 48 includes some circuitry tocontrol the respective equalizer 72 in the respective channel. Forinstance, the optical-to-host channel 40 may include clock and datarecovery (CDR) circuitry 94 to control equalization of the incomingdata. The CDR circuitry 94 is used to recover a clock using data changesin the optical signals and to then recover data using the recoveredclock. However, the CDR circuitry 94 may be relatively power hungry,larger, and/or slower to calibrate/adapt than PA/Ms 96 in lanes 32B and32C. Thus, by using a single CDR circuitry 94 in one of multiplechannels and having multiple PA/Ms 96 acting as slaves to the CDRcircuitry 94, the lanes 32B and 32C may consume less power than the lane32A. Furthermore, when the links 50 include routing longer than acertain length (e.g., longer than extra short reach (XSR) and ultrashort reach (USR)), each equalizer 72 may utilize separate CDRcircuitries instead of the CDR-PA/M scheme due to the longer length ofthe links. Thus, by taking advantage of the nature of the links 50 foruse in short connections (e.g., XSR or USR), CDR circuitries may bereplaced by lower-power PA/Ms in certain lanes (e.g., in all but onelane), thereby reducing power, area, and/or calibration/adaption time.

Furthermore, the clocking scheme illustrated in the connection 30provides a flexible clocking scheme that supports single or multipleclock domains. Furthermore, the common clock 81 and/or the forwardclocks 86, 88 in a simple channel equalization scheme that combinesproduction characterizations, calibrations, and equalization tuning tofully utilize the short distances of the links 50 and channelcharacteristics.

FIG. 3 is a schematic diagram of a connection 100 that is similar to theconnection 30 except that the CDR circuitry 94 for the lane 32A is movedto the host complex 34. In some embodiments, the host complex 34 mayutilize more robust equalization that may be better suited forperforming clock and data recovery. Furthermore, the connection 100utilizes elastic buffers 74 and equalizers 72 (and associated circuitry)in the host complex 34 rather than in the optical engine 36. Thus, inthe connection 100, the clock domain 75 extends across the links 50 andthe host complex 34 transitions incoming signals into the clock domain76. Furthermore, since the transition for optical-to-host channels 40,44, and 48 occur in the host complex 34, the forward clock 86 andassociated PA/Ms 90 may be omitted from the connection 100 when they areincluded in the connection 30. Beyond these differences, the twoconnections 30 and 100 may be structured similarly and vary based onwhere clock domain switching occurs. Both the connections 30 and 100 mayutilize the CDR circuitry 94 in a single lane 32A to drive slave PA/Ms96 to reduce power, area, and/or calibration/adaption time overconnections utilizing CDR circuitry for each lane of a connection.

FIG. 4 is a flow diagram of a process 200 that may be used by theelectronic device 10. The electronic device 10 sends outgoing signalsusing multiple lanes of an interconnection between a first semiconductorcomponent (e.g., component 14) and a second semiconductor component(e.g., component 16) (block 202), The outgoing signals go out from thefirst semiconductor component to the second semiconductor component.

The electronic device 10 also transmits a first incoming signal from thesecond semiconductor component to the first semiconductor componentusing a first lane of the multiple lanes (block 204). Transmitting thefirst incoming signal includes transitioning the first incoming signalfrom a first clock domain corresponding to the second semiconductordevice to a second clock domain corresponding to the first semiconductordevice. Moreover, transitioning the first incoming signal from the firstclock domain to the second clock domain comprises utilizing clock anddata recovery circuitry corresponding to the first land.

The electronic device 10 further transmits a second incoming signal fromthe second semiconductor component to the first semiconductor componentusing a second lane of the multiple lanes (block 206). Transmitting thesecond incoming signal includes transitioning the second incoming signalfrom the first clock domain to the second clock domain, andtransitioning the second incoming signal from the first clock domain tothe second clock domain includes utilizing phase adjustment and clockmultiplier circuitry that is a slave to the clock and data recoverycircuitry.

With the foregoing in mind, the electronic device 10 may be a part of adata processing system or may be a component of a data processing systemthat may benefit from use of the low-power interconnect links discussedherein. For example, the electronic device 10 may be a component of adata processing system 500, shown in FIG. 5. The data processing system500 includes a host processor 502, memory and/or storage circuitry 504,and a network interface 506. The data processing system 500 may includemore or fewer components (e.g., electronic display, user interfacestructures, application specific integrated circuits (ASICs)).

The host processor 502 may include any suitable processor, such as anINTEL® XEON® processor or a reduced-instruction processor (e.g., areduced instruction set computer (RISC), an Advanced RISC Machine (ARM)processor) that may manage a data processing request for the dataprocessing system 500 (e.g., to perform machine learning, videoprocessing, voice recognition, image recognition, data compression,database search ranking, bioinformatics, network security patternidentification, spatial navigation, or the like). The memory and/orstorage circuitry 504 may include random access memory (RAM), read-onlymemory (ROM), one or more hard drives, flash memory, or the like. Thememory and/or storage circuitry 504 may be considered external memory tothe electronic device 10 and may hold data to be processed by the dataprocessing system 500 and/or may be internal to the electronic device 10(e.g., as the components 14 and 16). In some cases, the memory and/orstorage circuitry 504 may also store configuration programs (e.g.,bitstream) for programming a programmable fabric of the electronicdevice 10. The network interface 506 may permit the data processingsystem 500 to communicate with other electronic devices. The dataprocessing system 500 may include several different packages or may becontained within a single package on a single package substrate.

In one example, the data processing system 500 may be part of a datacenter that processes a variety of different requests. For instance, thedata processing system 500 may receive a data processing request via thenetwork interface 506 to perform machine learning, video processing,voice recognition, image recognition, data compression, database searchranking, bioinformatics, network security pattern identification,spatial navigation, or some other specialized task. The host processor502 may cause a programmable logic fabric of the electronic device 10 tobe programmed with a particular accelerator related to requested task.For instance, the host processor 502 (e.g., component 14) may instructthat configuration data (bitstream) be stored on the memory/storagecircuitry 504 or cached in sector-aligned memory of the electronicdevice 10 to be programmed into the programmable logic fabric of theelectronic device 10. The configuration data (bitstream) may represent acircuit design for a particular accelerator function relevant to therequested task.

The methods and devices of this disclosure may be incorporated into anysuitable circuit. For example, the methods and devices may beincorporated into numerous types of devices such as microprocessors orother integrated circuits. Exemplary integrated circuits includeprogrammable array logic (PAL), programmable logic arrays (PLAs), fieldprogrammable logic arrays (FPLAs), electrically programmable logicdevices (EPLDs), electrically erasable programmable logic devices(EEPLDs), logic cell arrays (LCAs), field programmable gate arrays(FPGAs), application specific standard products (ASSPs), applicationspecific integrated circuits (ASICs), and microprocessors, just to namea few. Furthermore, although the foregoing discusses an interconnectbetween a die and an optical engine, interconnects between otherelectronic devices may employ similar techniques. For instance, in someembodiments, the optical engine may be replaced or supplemented with atransceiver/serializer-deserializer engine. Additionally oralternatively, the optical engine may be replaced with any semiconductordie that may be connected to another die using the links 50. Forinstance, the first and second components 14 and 16 may each be a dieeach including one or more of the following: an FPGA, a CPU, an ASIC,memory, and other semiconductor die used in computing devices and/orincluded on an SOC.

Moreover, while the method operations have been described in a specificorder, it should be understood that other operations may be performed inbetween described operations, described operations may be adjusted sothat they occur at slightly different times or described operations maybe distributed in a system which allows the occurrence of the processingoperations at various intervals associated with the processing, as longas the processing of overlying operations is performed as desired.

The embodiments set forth in the present disclosure may be susceptibleto various modifications and alternative forms, specific embodimentshave been shown by way of example in the drawings and have beendescribed in detail herein. However, it may be understood that thedisclosure is not intended to be limited to the particular formsdisclosed. The disclosure is to cover all modifications, equivalents,and alternatives falling within the spirit and scope of the disclosureas defined by the following appended claims. In addition, the techniquespresented and claimed herein are referenced and applied to materialobjects and concrete examples of a practical nature that demonstrablyimprove the present technical field and, as such, are not abstract,intangible or purely theoretical. Further, if any claims appended to theend of this specification contain one or more elements designated as“means for [perform]ing [a function] . . . ” or “step for [perform]ing[a function] . . . ” it is intended that such elements are to beinterpreted under 35 U.S.C. 112(f). For any claims containing elementsdesignated in any other manner, however, it is intended that suchelements are not to be interpreted under 35 U.S.C. 112(f).

What is claimed is:
 1. An electronic device comprising: an interconnectcoupling a first semiconductor device and a second semiconductor device,wherein the interconnect comprises a plurality of lanes thatrespectively comprise a link between the first and second semiconductordevices, wherein a first lane of the plurality of lanes comprises clockand data recovery circuitry, wherein a second lane of the plurality oflanes comprises phase adjustment and clock generation circuitry, whereinthe clock and data recovery circuitry provides an input to the phaseadjustment and clock generation circuitry, and wherein the first lanecomprises an equalizer that adjusts incoming signals at least in part oncontrols from the clock and data recovery circuitry.
 2. The electronicdevice of claim 1, wherein the clock generation circuitry comprisesclock multiplication circuitry.
 3. The electronic device of claim 1,comprising an second-lane equalizer that corresponds to the second lane,wherein the second-lane equalizer is configured to adjust incomingsignals based at least in part on controls from the phase adjustment andclock generation circuit.
 4. The electronic device of claim 1, whereinthe first semiconductor device comprises multiple die.
 5. The electronicdevice of claim 4, wherein the multiple die comprise afield-programmable gate array, a central processing unit, a memory, anapplication-specific integrated circuitry, or any combination thereof.6. The electronic device of claim 1, wherein the second semiconductordevice comprises multiple die.
 7. The electronic device of claim 1,wherein the second semiconductor device comprises an optical engine thatprovides an interface between the first semiconductor device and anoptical fiber via the interconnect.
 8. The electronic device of claim 1,wherein the plurality of lanes respectively comprise: an outgoingchannel from the first semiconductor device to the second semiconductordevice; and an incoming channel from the second semiconductor device tothe first semiconductor device.
 9. The electronic device of claim 8,wherein the respective outgoing channels of the plurality of lanes use acommon clock and a forward clock that is generated from the common clockand transported over a respective link from the first semiconductordevice to the second semiconductor device.
 10. The electronic device ofclaim 8, wherein the incoming channel of the first lane uses the clockand data recovery circuit, and wherein the incoming channel of thesecond lane is driven by the clock and data recovery circuit.
 11. Theelectronic device of claim 1, wherein the second semiconductor devicecomprises the clock and data recovery circuitry of the first lane,wherein the second semiconductor device comprises an elastic buffer ineach of the plurality of lanes, and wherein the second semiconductordevice, in each of the plurality of lanes, translates signals targetedfor the first semiconductor device from a first clock domain to a secondclock domain before the signals are transmitted over a respective linkto the first semiconductor device.
 12. The electronic device of claim 1,wherein the first semiconductor device comprises the clock and datarecovery circuitry of the first lane, and wherein the firstsemiconductor device comprises an elastic buffer in each of theplurality of lanes.
 13. The electronic device of claim 1, wherein thesecond semiconductor device passes through, to the first semiconductordevice, an embedded clock signal with incoming data received at thesecond semiconductor device.
 14. The electronic device of claim 1,wherein a respective link of the plurality of lanes comprises an extrashort reach or an ultra short reach.
 15. The electronic device of claim1, wherein the second semiconductor device comprises atransceiver/serial-deserializer engine.
 16. A method, comprising:transmitting outgoing signals using a plurality of lanes of aninterconnection between a first semiconductor component and a secondsemiconductor component, wherein outgoing signals are transmitted fromthe first semiconductor component to the second semiconductor component;transmitting a first incoming signal from the second semiconductorcomponent to the first semiconductor component using a first lane of theplurality of lanes, wherein transmitting the first incoming signalcomprises transitioning the first incoming signal from a first clockdomain corresponding to the second semiconductor component to a secondclock domain corresponding to the first semiconductor componentutilizing clock and data recovery circuitry corresponding to the firstlane; and transmitting a second incoming signal from the secondsemiconductor component to the first semiconductor component using asecond lane of the plurality of lanes, wherein transmitting the secondincoming signal comprises transitioning the second incoming signal fromthe first clock domain to the second clock domain based at least in parton the clock and data recovery circuitry corresponding the first lane.17. The method of claim 16, wherein transitioning the first and secondincoming signals between clock domains comprises respectively equalizingthe first and second incoming signals using respective first and secondequalizers.
 18. The method of claim 17, wherein equalizing the firstincoming signal using the first equalizer comprises driving the firstequalizer based at least in part on control signals from the clock anddata recovery circuitry; and wherein equalizing the second incomingsignal using the second equalizer comprises driving the second equalizerbased at least in part on control signals from a phase adjustment andclock generation circuitry of the second lane.
 19. A system-on-a-chipcomprising: a circuit board; a substrate coupled to the circuit board; afirst semiconductor device coupled to the substrate; a secondsemiconductor device coupled to the substrate; and an interconnectcoupled between the first and second semiconductor devices, wherein thesystem-on-a-chip comprises a connection including portions of the firstsemiconductor device, the second semiconductor device, and theinterconnect, wherein the connection comprises a plurality of lanescomprising: a plurality of outgoing channels receiving outgoing datafrom the first semiconductor device and transmitting the outgoing datato the second semiconductor device over the interconnect; and aplurality of incoming channels receiving incoming data at the secondsemiconductor device and transmitting the incoming data over theinterconnect to the first semiconductor device, wherein each incomingchannel transfers incoming data between a first clock domain of thesecond semiconductor device and a second clock domain of the firstsemiconductor device, wherein clock and data recovery circuitry of asingle incoming channel of the plurality of incoming channels drivestransfers of the incoming data between the first clock domain and thesecond clock domain for the plurality of incoming channels.
 20. Thesystem-on-a-chip of claim 19, wherein the single incoming channelcomprises an equalizer that adjusts the incoming data.